Memory Standard: Supports 1R 5600 MHz (by JEDEC & POR)
- 1DPC 1R Max speed up to 6800+ MHz
- 1DPC 2R Max speed up to 6400+ MHz
- 2DPC 1R Max speed up to 6400+ MHz
- 2DPC 2R Max speed up to 5600+ MHz
Supports Intel XMP3.0 OC
Supports Dual-Controller Dual-Channel mode
Supports non-ECC, un-buffered memory
Volume / Net Weight: 1.5 ml in Syringe (Grease Cleaner is / are NOT Included)
Thermal Conductivity: 9.0 W/mK
Specifications: Specific Gravity: 2.6 (g/cm3) (25°C)
Color: Gray
Improves heat transfer from chipset to cooler base or heatpipes
Precise and Even
Easy to spread and remove without surface damage
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.