Features: 5600MT/s grants faster transmission speeds and higher bandwidth than DDR4
1.5x faster than standard 3200MT/s DDR4 to provide multi-core CPUs with extreme responsiveness
Available in 8GB, 16GB, and 32GB module densities
Doubled chip unit capacity compared to DDR4 (from 16GB to 32GB) for seamless multi-tasking
Low voltage of 1.1V for less power consumption
Improved reliability versus DDR4 with On-Die Error Correction Code (ECC)
Optimized efficiency with two independent 32-bit channels per module
High computing performance with double the banks and double the burst length compared to DDR4
Compatible with 13th Gen Intel Cor™ processors that support DDR5 and DDR5 compatible motherboards
Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.