Components & Storage

• Model #: lxzq-348

• Model #: 668706895544

• Model #: meiyoug-291

• Model #: ZXH-H10640

• Model #: T7B78AA-AX

• CAS Latency: CL1.5
• Color: Black
• LED Color: None
• Model #: 13L75AAAX

Limited time offer, ends 01/09

• Model #: AS5-35G

• Model #: ZXH-H11779

• Model #: WD-F10103

• Model #: WD-F12013

• Model #: WD-F10101

• Model #: YQC-T6937

• Model #: YQC-T7500

• Model #: YQC-T1530

• Model #: YQC-T6756

• Model #: MLN-10301

• CPU Type: Supports AMD EPYC 9005*/9004 (with AMD 3D V-Cache Technology) and 97x4 series processors
• Number of Processor Support: 1
• CPU Features: Thermal Design Power Up to 400W *A BIOS update is required to support AMD EPYC 9005 series processors
• Memory Slots: 16 x DDR5 288-pin
• Model #: TURIN2D16-2T

(2)

• CAS Latency: CL46
• Timing: 46-45-45-90
• Voltage: 1.10V
• Buffered/Registered: Unbuffered
• Model #: CTCCD564G5600HC46ADC-S01

• Model #: YMD9-S5E1D1208

(6)

OUT OF STOCK

• Brand: AsRock Rack
• Part Number: ALTRAD8UD-1L2T-Q64-22
• CPU Socket Type: Single Socket (LGA 4926)
• CPU Type: Ampere Altra Max/Ampere Altra processors
• Model #: ALTRAD8UD-1L2T-Q64-22

• Accessory Type: Cooler
• Color: Black
• Maximum support size: N/A
• Fan Numbers: N/A
• Model #: Fan-QN05

• Accessory Type: Cooler
• Model #: esf202207196

Limited time offer, ends 01/10

• Color: Black
• Mobile Rack Drives Support: 5 x 3.5" Drives to 3 x 5.25" Bays
• Mobile Rack Interface: SATA I/II/III/SAS
• Protection Case: Multiple Drives
• Model #: BP-SAC3051B

(7)

• CAS Latency: CL40
• Timing: 40-39-39-77
• Voltage: 1.10V
• Part Number: TED532G4800C40D-S01
• Model #: TED532G4800C40D-S01

• Volume / Net Weight: 3.5g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: < 0.49 micron < 0.000020 inch Extended Temperature Limits: Peak: -50 Celsius Degree to >180 Celsius Degree Long-Term: -50 Celsius Degree to 130 Celsius Degree Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Weight: Silver Thermal Paste
• Model #: 83219001014

• Voltage: 1.35V
• Compatible System: Asus/Asmobile X Series Notebook X55Vd, X55U, X55C
• CAS Latency: CL11
• Timing: 11-11-11
• Model #: 849005069410

• Model #: 693542163953

• Model #: X551Cfan

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G

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Limited time offer, ends 01/09

• Brand: ASRock
• CPU Socket Type: AM4
• Chipset: AMD A520
• Serial ATA (SATA): 4 x SATA3 6.0Gb/s Connectors, support RAID, NCQ, AHCI and Hot Plug
• Model #: A520M-HVS

• Model #: MLN-14758

• Brand: ASUS
• CPU Socket Type: AM4
• Chipset: AMD B550
• Serial ATA (SATA): 4 x SATA 6Gb/s
• Model #: 90MB14I0-M0EAY0

• Brand: Hynix
• Capacity: 4GB
• Speed: DDR4 2133 (PC4 17000)
• ECC: NON
• Model #: HMA451S6AFR8N-TF

(9)

• Brand: ASUS
• CPU Socket Type: FM2
• Chipset: AMD A55 (Hudson D2)
• USB 3.0: 2 x USB 3.0
• Model #: F2A55-M/CSM

(25)

• Brand: GIGABYTE
• CPU Socket Type: FM2
• Chipset: AMD A55 (Hudson D2)
• Form Factor: Micro ATX
• Model #: GA-F2A55M-DS2