Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the
Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
Part Number: Canned thermal paste has a unit price about 50% lower than syringe packaging, and is more recommended for large consumer groups such as physical stores, server fields, power battery fields, aerospace fields, etc.
Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Features: PTM7950 is a highly thermally conductive Phase Change Material (PCM) that lasts longer and is more effective than tradiational thermal paste.
Size 31x50x0.2mm, Phase change at 45°C, Thermal Conductivity: 8.5 W/m.K, It is normal for it to melt at high temperatures.It achieves good heat dissipation performance through repeated melting and solidification.