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Thermal Compound / Grease
Search Results: "small form factor"
Thermal Compound / Grease
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Liquid Metal by CSGR 1g & K5 PRO® 20g set 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty. High-performance cooling bundle that pairs liquid metal for direct die CPU/GPU use with K5 PRO®.
Model #:
Liquid Metal by CSGR 1g & K5 PRO
$
24
.99
–
Direct from COMPUTERSYSTEMS REPAIR SERVICES DATA REC
This product is sold direct from the manufacturer.
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Liquid Metal by CSGR 1g 79 W/m·K* high performance thermal interface for CPU/GPU upgrades. Ultrahigh thermal conductivity compound for serious cooling projects; electrically conductive.
Model #:
Liquid Metal by CSGR
$
19
.99
–
Direct from COMPUTERSYSTEMS REPAIR SERVICES DATA REC
This product is sold direct from the manufacturer.
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UPSIREN U6 PRO 50g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky compound for tight layouts; ideal layer thickness ~12 mm; targets GDDR6 VRAMs
Model #:
UPSIREN U6 PRO 50g
$
51
.00
–
Free Shipping
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This product is sold direct from the manufacturer.
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CS FLUX 10g halogen free, lead free no clean flux for SMD microsoldering; transparent when heated. low viscosity gel that liquefies under heat and wicks beneath components, turning clear.
Model #:
flux10
$
21
.99
–
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UPSIREN U6 PRO 10g jar Thermal putty for thin heat sinks in gaming laptops and slim consoles. Soft, lightly tacky thermal putty that levels mixed heights and stays in place.
Model #:
U6_10g
$
14
.99
–
Free Shipping
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