Thermal conductive heatsink copper pad shims assortment kit including 10 gram thermal conductive adhesive glue.
[Main Body Material: Copper C1100].
Thermal conductivity: 401W/mK.
100pcs 15mm x 15mm ( 0.6 x 0.6 inches) 12 thickness copper pad shim heat sink includes:
12pcs ( 0.1 mm)
12pcs ( 0.2 mm)
12pcs ( 0.3 mm)
12pcs ( 0.4 mm)
12pcs ( 0.5 mm)
12pcs ( 0.6 mm)
5pcs ( 0.8 mm)
5pcs (1mm)
5pcs ( 1.2 mm)
5pcs ( 1.5 mm)
5pcs ( 1.8 mm)
3pcs (2mm)
Can be applied as a gap filler, cooler thermal conductive pad in cooling PC Components Development Boards Laptop CPU GPU VRAM GPU VGA RAM IC Chips SSD PS5 M. 2 NVMe 2280, etc