Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Features: PTM7950 is a highly thermally conductive Phase Change Material (PCM) that lasts longer and is more effective than tradiational thermal paste.
Size 31x50x0.2mm, Phase change at 45°C, Thermal Conductivity: 8.5 W/m.K, It is normal for it to melt at high temperatures.It achieves good heat dissipation performance through repeated melting and solidification.
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread card.
Specific Gravity: 2.7g/cm3