Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: Wire Size: 30 Gauge
Latch Style: Press Type
Directional: No
Connector: SFF-8087
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 19.69"
8 mm x 5 mm x 500 mm