"HW-D-CP24-R"

• Model #: TH-501725

• Model #: TH-501702

• Model #: TH-108005

Limited time offer, ends 01/15

• Model #: TH-005-AR

• Model #: TH-108002

• Model #: TH-501704

(4)

• Volume / Net Weight: 4.0g
• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -40 to 180 C
• Specifications: Viscosity: 47 Pa-s Dimensions: 6.6" (L) x 4.49" (W) x 0.62" (H) Weight: 4 g Shelf Life: 24 months Color: Grey
• Model #: CL-O024-GROSGM-A

• Model #: TH-501710

• Model #: TH-301304

• Volume / Net Weight: 50.0g
• Thermal Conductivity: 12 W/mk
• Long Term Operating Temperature: -50 to 240 C
• Specifications: Low Therm,al Resistance
• Model #: TH-201250

• Model #: TH-201204

• Model #: TH-201210

• Model #: TH-301325

• Model #: TH-301302

• Model #: TH-501701

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G

(19)

• Part Number: CT-9010010-WW
• Volume / Net Weight: 3.0g
• Model #: CT-9010010-WW

OUT OF STOCK

• Volume / Net Weight: 20g
• Thermal Conductivity: 1.06 W/mK
• Specifications: Color: White Bleed: <0.05% at 200°C/24 hours Evaporation: <0.001% at 200°C/24 hours Materials: Silicone Compounds 50% Carbon Compounds 20% Metal Oxide Compounds 30% Thermal Resistance: <0.195°C-m2/W Thermal Conductivity: >1.066 W/(m·K)
• Parts: 2 Year
• Model #: HEATGREASE20