Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating.
With this copper pad to greatly lower gpu temperatures, can be used for graphics, northbridge, CPU chips.
It can be used as heatsink solution for Xbox ,PS4 and all laptop and computer such as HP,Dell,Acer,Thinkpad etc.
Package included:
10 pcs Thermal Conductive Copper Shims 20mm x 20mm x 0.5mm