Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: Safety
IEC 60950-1, EN 60950-1, CB Certificate/Report, UL/CSA 60950-1
EMC
CC / ICES-003 Emission (USA/Canada)
CRISP 22 Emission (International)
EN61000-4-2 Electrostatic Discharge
EN61000-4-3 Radiated RFI Immunity
EN61000-4-4 Electrical Fast Transients level 4
EN61000-4-5 Electrical Surge Level
EN61000-4-6 RF Conducted
EN61000-4-8 Power Frequency Magnetic Fields
EN61000-4-11 Voltage Dips and Interruptions
EN61000-4-8 Power Frequency Magnetic Fields
EN61000-4-11 Voltage Dips and Interruptions