Specifications: The thermal conductivity of CTG10 thermal paste reaches 14.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into
Features: Anodized Black Aluminum fin heatsink cooling , generally used in heat treatment and the cooling IC and electronic component, for example: RAM, CPU Memory , GPU, Graphics Card, Vidoe Card,also can be used for cooling of , northbridge ,Southbridge ,motherboard, power transistor, FET, IC, power amplifier, Voltage Regulator,1W LED etc.
The fins increase the area of the board and thus provide for greater heat transfer.
Use heatsink adhesive glue to install heatsink on the IC.Glue is not included here.
Size is 28mm x 28mm x 11mm low profile , Please check the specification table and make sure that the size of the heatsink fits that of your component.
Specification
Product Name: Heatsink
Material: Aluminium
Color: Anodized Black
Overall Size: 28 x 28 x 11mm/1.10" x 1.10"x 0.43"(L*W*H)
Weight: 5...
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.