Block Compatibility: M.2 length support: 2280 (22mm x 80mm)
Type: Cooling kit
Block Dim.: Heatsink : 70mm (W) x 10mm (H) x 20mm (D), 16.1g
Blue Pad : 70mm (W) x 1mm (H) x 20mm (D), 3.25g
Gray Pad 1 : 60mm(W) x 1mm(H) X 20mm(D), 2.8g
Gray Pad 2 : 60mm(W) x 1.5mm(H) X 20mm(D), 3.7g
Thermal pad thickness: 1.0mm, 1.5mm
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating.
With this copper pad to greatly lower gpu temperatures, can be used for graphics, northbridge, CPU chips.
It can be used as heatsink solution for Xbox ,PS4 and all laptop and computer such as HP,Dell,Acer,Thinkpad etc.
Package included:
10 pcs Thermal Conductive Copper Shims 20mm x 20mm x 1.2mm
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,