Thermal Grizzly Duronaut Pro - 2g - Grey Thermal Paste (TG-DP-002-R)

Thermal Grizzly Duronaut Pro is a high-end thermal paste (thermal compound) for CPUs, GPUs, notebooks and ICs, here in the 2g size. It is also available in 6g and 30g sizes.

Properties

• Amount: 2g
• Fillers: Aluminum microparticles, zinc oxide nanoparticles
• Carrier: Specially developed silicone oil
• Electrical conductivity: 0 pS/m, electrically non-conductive for safe installation
• Color: Gray
• Weight: 2 g net, 12 g boxed

Who it is for

The paste was developed for enthusiasts, overclockers and professionals seeking the highest levels of cooling performance and long-term reliability. Thermal Grizzly calls it an ideal high-end paste for gamers and overclockers, and recommends it as a top-tier product for demanding industrial cooling systems. That covers high-performance CPUs and GPUs and other demanding cooling applications, with dependable operation in gaming PCs, workstations, servers and overclocked systems. Whether you're assembling a flagship gaming PC or optimizing a professional workstation, the aim is the same: outstanding thermal efficiency and long-lasting reliability you can count on.

Features

• Extreme long-term stability with minimal pump-out
• Enhanced thermal conductivity for superior cooling performance
• An electrically non-conductive formula, which provides additional installation safety
• Will not dry out or harden over time, and the paste needs no curing

Long-term stability and the pump-out effect

The name "Duronaut" is derived from the English term "durability." Building on the proven Duronaut formula, this premium version delivers enhanced thermal conductivity while maintaining exceptional durability. Thermal Grizzly gets that stability from a specially engineered silicone oil and an advanced formulation that combines aluminum microparticles (micropowder) with zinc oxide nanoparticles (nanopowder) in optimized shapes and sizes. The carefully balanced particle structure minimizes the pump-out effect, the expulsion of paste caused by repeated thermal cycling between a heatspreader and a cooler, while providing excellent adhesion to the surface. The data sheet adds that pump-out increases significantly at high temperatures. It is particularly critical between materials with differing coefficients of thermal expansion, for example a silicon GPU chip and a copper heatsink. Designed for years of consistent performance, the paste remains stable over extended use without drying out or hardening.

Ultra-thin layers

The formula is optimized for ultra-thin application layers. A silicone matrix serves as the carrier material and is filled with a high proportion of thermally conductive fillers, the aluminum microparticle and zinc oxide nanoparticle mix. Thanks to its small particle size the paste goes on as an ultra-thin application layer, which the data sheet calls an extremely thin bond line. The result is extremely low thermal contact resistance, ensuring highly efficient heat transfer between the heat source (e.g., a CPU) and the cooler.

Applying it

Every package includes both the standard TG Spatula and the redesigned TG Spatula Pro, for the best possible application. The Pro's improved design allows greater pressure on the surface during application, making it easier to spread the compound efficiently into an exceptionally thin, even layer for maximum cooling performance.

In the box

Package contents of the 2g version:

• 1x Duronaut Pro 2g
• 1x Applicator
• 1x TG Spatula
• 1x TG Spatula Pro