Thermal Grizzly Hydronaut Pro - 30g Thermal Paste, Yellow (TG-HP-030-R)

Thermal Grizzly Hydronaut Pro is a silicone-free thermal paste for CPUs, GPUs, notebooks and ICs, made for large-surface heat sinks such as custom water cooling. This is the 30g version. The paste is available in 2g, 6g, and 30g sizes, so the others are 2g and 6g.

Properties

• Amount: 30g
• Carrier: Silicone-free
• Electrical conductivity: 0 pS/m
• Color: Neon green
• Typical application: CPUs, GPUs, notebooks, ICs
• Boxed: 58g gross, 8.2 x 4.2 x 6.1 cm

Who it is for

It is sold as a premium paste, engineered without silicone for industrial applications, high-performance PCs, and demanding cooling environments. Its outstanding thermal conductivity suits large-surface coolers and heat spreaders, and it is optimized for systems with custom water cooling. That makes it an ideal choice whether you're building custom water-cooled gaming PCs, assembling workstations or maintaining industrial equipment. With its large capacity, this size is an excellent choice for frequent system builders, repair technicians, enthusiasts and anyone servicing multiple systems. Overclocking is covered too: the data sheet names overclocked processors and processors with a high TDP in watts (Intel Core i5/i7, AMD Ryzen 5/7). Thermal Grizzly describes the price-performance ratio as attractive. Its other silicone-free paste is Hydronaut.

Silicone-free formulation

Unlike conventional thermal compounds, this one utilizes a carrier structure that features no silicone. Many thermal pastes rely on silicone-based oils (e.g., siloxanes) as the carrier fluid or as a component of the matrix. Under repeated thermal cycling those oils can separate or migrate, potentially causing bleeding over time. Micro-movements between the CPU IHS and the cooler base can intensify this, and the mechanical displacement of paste from the contact surface is referred to as the pump-out effect. While this is generally not an issue in consumer PCs, industrial environments often require silicone-free materials. Leaking oil can be incompatible with seals, gaskets, and other sensitive components nearby (e.g., certain EPDM or NBR seals), leading to swelling or changes in material properties. Doing without the use of silicone-based carrier oils is meant to prevent those compatibility issues, and the paste is resistant to pump-out caused by thermal cycling. It is also RoHS compliant, making it suitable for professional applications where material compatibility is critical.

Heat transfer and long-term stability

Its advanced formulation minimizes thermal interface resistance while maintaining excellent adhesion between the processor and cooler. The result is efficient heat transfer: the paste delivers consistent cooling even under heavy workloads, combining that with dependable performance in the long run. The paste remains electrically non-conductive for safe installation. It needs no curing and no hardening sets in: it will not harden over time, ensuring reliable performance throughout the life of the system.

Applying it

For precise application, the 30g version includes the redesigned TG Spatula Pro along with the standard TG Spatula. They work by allowing you to spread the compound into an exceptionally thin and even layer, which is what gives maximum cooling performance. The revised design of the Pro spatula takes increased pressure during application, so the paste spreads efficiently and the layer comes out thinner. Both spatulas are part of the package contents listed below.

In the box

• 1x Hydronaut Pro 30g
• 1x TG Spatula
• 1x TG Spatula Pro