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Thermal Conductive TechnologyIncluding the unique Thermal Conductive Technology, each memory chip's surface makes direct contact with the heatsink to perform immediate heat spreading from critical areas. This keep ICs and the PCB operating at a low temperature, thus ensuring high stability while delivering supremely high performance. The ADATA XPG Gaming v2.0 Series adopts the extruded heatsink that extends to increase surface area, providing superior thermo-conduct capability, efficiently reducing power consumption and greatly elevating the signal completion emitted from the memory module.
2OZ double-copper PCBADATA Gaming v2.0 Series employs the industry-leading 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability.
The Highest Standard for Stability and EfficiencyADATA XPG Gaming v2.0 Series memory products are made in conformation with JEDEC regulations and DDR3-1333 standards at CL value of 9-9-9-24. Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process, complete with superior 8-layer PCB (Printed Circuit Board) and unique heat dissipation technology that effectively lowers module temperature, improves power consumption and prolongs the lifespan of memory, proven to meet or exceed specifications to make complete use of the computer’s power.
4GB (2 x 2GB) DDR3 1600MHz (PC3-12800) KitThis ADATA XPG Gaming v2.0 memory kit populates your dual channel system with a massive 4GB of system memory for amazing multitasking performance and is tested to run at 1600MHz at latency of 9-9-9-24 and 1.55V-1.75V for better compatibility.