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Brand | Team |
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Series | Xtreem LV |
Model | TXD316G2400HC10QQC01 |
Capacity | 16GB (4 x 4GB) |
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Speed | DDR3 2400 (PC3 19200) |
CAS Latency | 10 |
Timing | 10-12-12-31 |
Voltage | 1.65V |
ECC | No |
Buffered/Registered | Unbuffered |
Multi-channel Kit | Quad Channel Kit |
Heat Spreader | Yes |
Features | Team Xtreem LV is the most popular overclocking and gaming gear in the LAN party. Based on the memory architecture evolution on Intel Core i7, Team raises the frequency of the Xtreem LV DDR3 by 20% from 2000MHz to 2400MHz. All these have witnessed the extraordinary R&D capacity and capability of Team. In addition to the unchanged genuine chip policy, Team ensures chip quality with the exclusive sorting technology to screen chips. In order to further ensure the optimal performance and flawless quality of the Xtreem LV DDR3 2400, The Xtreem LV DDR3 2400 from Team has a conventional 8-layered PCB design and is covered with the X-mark heat-sink labeled for the Xtreem series. In addition to the clean appearance as found in all Team Xtreem memory modules, a groove has been added to the heat-sink for power users to install fans on top to enhance ventilation |
Date First Available | December 04, 2012 |
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