PTI-G4512 Thermal Conductive Compound is an excellent thermal conductive solution for medium-power devices. PTI-G4512 is formulated with an advanced silicone fluid that interacts with thermally conductive filler particles to form a highly stable matrix that helps to prevent pump-out and other common failure mechanisms. PTI-G4512 delivers very good thermal performance and high reliability. Molecularly small and structurally stable, the multi-award winning PTI-G4512 is the perfect thermal compound for your needs of cooling devices.
Maximizes Heat TransferThe high-performance silicon-base thermal grease PTI-G4512 eliminates minute air gaps between the heat source and the heat sink caused by their uneven surfaces. With thermal conductivity up to 2.5 W/m.k, it outperforms standard thermal compounds 4 to 10 degrees lower CPU full load core temperature.
Long-lasting performanceThe non-curing & non-corrosive odorless thermal compound will not dry out, harden or melt and can even be stable at elevated temperatures. Having no metal or any other conductive material, the PTI-G4512 will not result in any damage even when it contacts to electrical traces, pins and leads.
Easy to applyIn syringe and brush attached enables easy application and prevents unnecessary waste.