With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
Learn more about the Cooler Master RG-ICFN-200G-B1
Model
Brand
COOLER MASTER
Series
IceFusion 200G Value Pack
Model
RG-ICFN-200G-B1
Details
Volume / Net Weight
200g
Thermal Conductivity
1.22 W/mK
Specifications
Color: White Specific Gravity @ 25°C: >2.5 Dielectric Constant: >5.1 at 100Hz Dissipation Factor: <0.005 at 100Hz Temperature Stability (°C): -50 ~ 24°C Thermal Conductivity (W/m-K): >1.22 Net Weight: 200 grams / 0.44lbs
Features
Features
System builder value size contains enough compound for 500 applications
Resealable package
High thermal conductivity.
Low thermal resistance.
Non-corrosive.
Best thermal stability in high temperature.
Excellent adhesion.
Preserve in room temperature for longer lifespan.
Additional Information
Date First Available
February 24, 2010
Customer Reviews of the Cooler Master RG-ICFN-200G-B1