Single review: G.SKILL 2GB 200-Pin DDR2 SO-DIMM DDR2 533 (PC2 4200) Laptop Memory Model F2-4200CL4S-2GBSK

G.SKILL 2GB 200-Pin DDR2 SO-DIMM DDR2 533 (PC2 4200) Laptop Memory Model F2-4200CL4S-2GBSK

DDR2 533 (PC2 4200)
CAS Latency 4
1.80V

Physical Size is Out Of Spec 06/24/2010

This review is from: G.SKILL 2GB 200-Pin DDR2 SO-DIMM DDR2 533 (PC2 4200) Laptop Memory Model F2-4200CL4S-2GBSK

Pros:

looks good before you have to mutilate it, runs properly after you mutilate it.

Cons:

The heat spreader makes the module larger than spec, and if you have a laptop with tight tolerances it will not fit until you peel off the heat spreader, which voids the warranty and removes the informative sticker. I tried to put these in a Panasonic Toughbook (T19).

Overall Review:

I think these particular "heat spreaders" are actually just an aesthetic gimmick. They are not bonded with a thermal compound, but instead with an insulative sticker, which defeats the whole purpose.

They probably run cooler now that I have removed their "insulation".

G-Skill, guys... come on. This is pathetic.

Manufacturer Response:

.
Dear Customer

We apologize for the inconvenience. The heat spreader should not affect installation. The modules are within spacing specifications so they will fit tightly if anything, but they are surely compatible. Regarding PCB to heat spreader contact, no modules use thermal compound as that is for CPUs only. If you have any further questions or issues, please feel free to let us know.

Thank you
GSKILL SUPPORT

Quality and customer service are our top priorities.

Tech Support Email: ustech@gskillusa.com
RMA Dept Email: rma@gskillusa.com
G.Skill Forum: http://www.gskill.us/forum/

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JOHN R.
Owned For: 1 day to 1 week

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