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Exceptional PerformanceThe Antec Formula 6 boasts diamond particles measuring 0.0000015 cm rated at 5.3 w/mK that lead to an extremely high thermal conductivity. Extended -30°C to 250°C stable temperature range guarantees quick and efficient dissipation of heat from the CPU ideal for performance cooling.
High DurabilityUnlike transitional thermal compounds that show decreasing performance over time, this lighter, easier to spread stable composition won’t crack or dry out, delivering excellent long-lasting thermal conductivity.