|Specifications||Thermal Conductivity: >3.8 W/m-K|
Thermal Resistance: <0.087°C -in2/W
Specific Gravity: >2.5
Operating Temp.: -50°C to 240°C
Ingredient: Silicone Compounds 50%, Carbon Compounds 20%, Metal Oxide Compounds 20%, Diamond Particle 10%
|Features||Biostar Nano Diamond Thermal Compound is an ultra conductive thermal compound which is speacially blended for hi-performance heatsinks.|
The featured ingredient of Biostar Nano Diamond Thermal Compound is Nano Diamond whose well-known characteritics are high thermal conductivity and complete insulation.
It only takes a small amount for each application to greatly enhance the performance of heatsink.
Besides, Biostar Nano Diamond Thermal Compound is totally free from the possibly electric conduction of those metallic based thermal compound.
Biostar Nano Diamond Thermal Compound is an optimal choice for the best performance and safety purpose.
|Date First Available||December 07, 2010|