Coxbyte TG-50 is a 4 g thermal paste rated at 18.2 W/mK, designed for users applying thermal compound to CPUs, GPUs, or servers who want high thermal conductivity and a non-conductive formula.
Recommended For
- DIY desktop builders replacing paste when reseating a CPU cooler, especially on gaming or workstation PCs. Coxbyte positions its TG series for CPU use and describes TG-50 as a spreadable, non-conductive paste; independent comparative testing of TG-50 was not found.
- PC repairers repasting a GPU’s processor die during heatsink service, rather than using paste to fill gaps around memory or power-delivery components. Coxbyte lists GPU use, while community guidance distinguishes die paste from putty for uneven-height components.
- DIY maintainers of workstation or other electronics that use a conventional paste layer between a chip and heatsink, and who are comfortable applying and spreading thermal compound. Coxbyte lists workstations and industrial devices as intended uses, but independent TG-50 performance data was not found.
Spec Summary
| Attribute | Value |
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| Best For | CPU and GPU thermal-interface applications, including gaming consoles, AI computing cards, and 5G base-station cooling modules |
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| Thermal Performance | 18.2 W/m·K measured thermal conductivity; after curing, operates from -50°C to 250°C |
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| Composition And Electrical Properties | Composite nano-carbon-tube and liquid-metal formula; non-conductive |
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| Application Characteristics | 150,000 cP viscosity; supports single-point or nine-point application and spreads into thin, uniform layers |
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| Durability | Rare-earth antioxidants; stated performance degradation of less than 1% over 8 years and passed a 2,000-hour 85°C/85% RH aging test |
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| Interface Compatibility | Compatible with copper, aluminum, and nickel-plated interfaces |
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| Net Weight | 4 g |
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| Model Identifiers | Coxbyte TG series, model 50 |
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