Coxbyte TG-30 is a 2 g thermal paste rated at 17.5 W/mK for CPU and GPU cooling, suited to gaming PCs, high-performance graphics cards, workstations, and compact server cooling modules.
Recommended For
- PC builders repasting one desktop CPU during a cooler reinstall or routine maintenance; Coxbyte positions TG-30 for desktop CPU use, and its 2 g package suits a small repair rather than bulk servicing.
- Experienced PC repairers servicing a single graphics card or gaming laptop who are comfortable removing and reinstalling the cooler; Coxbyte lists CPU and GPU replacement among TG-30’s intended uses.
- Builders who prefer a non-electrically-conductive paste for a CPU or GPU application; Coxbyte describes TG-30 as electrically insulating, while Tom’s Hardware explains why conductivity can matter if paste spills onto nearby components.
- DIY desktop builders applying paste to a conventional CPU heat spreader who want a straightforward small-amount application; GamersNexus found that several application methods work similarly on smaller desktop CPUs when enough paste covers the heat spreader.
Real-World Use Scenarios
- When installing or reseating a desktop CPU cooler, apply TG-30 between the processor and cooler; it fills small contact gaps so heat can transfer to the cooling system during everyday use or demanding workloads.
- During a compatible graphics-card cooler repair or repaste, use TG-30 at the GPU-to-cooler contact; proper contact helps the heatsink draw heat away while gaming or running graphics workloads.
- When servicing a gaming laptop, a repairer can use TG-30 on CPU or GPU surfaces designed for paste; the repaste supports heat transfer, but it does not replace thermal pads or putty used on other components.
- After removing a processor cooler for a PC upgrade or repair, clean off the old compound and apply fresh TG-30 before reinstalling the cooler; this restores the thermal interface rather than relying on disturbed, uneven residue.
- For workstation or small-server maintenance, a technician can use TG-30 when renewing paste between a compatible processor and heatsink; it supports the thermal contact needed during sustained computing, while system temperatures still depend on cooler fit, airflow, and workload.
Spec Summary
| Attribute | Value |
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| Best For | Thermal-interface cooling for CPUs and GPUs in gaming systems, workstations, graphics cards, and small server modules |
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| Thermal Performance | 17.5 W/mK thermal conductivity; composite antioxidants are reported to limit performance degradation to less than 2% within six months |
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| Operating Temperature And Durability | After curing, withstands -50 to 250 °C; no dry cracking or carbonization is reported during continuous high-temperature operation |
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| Application And Compatibility | Supports single- or nine-point application, spreading into a 0.15 mm thermal layer; compatible with copper, aluminum, and nickel-plated metal interfaces |
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| Electrical Safety And Composition | Non-conductive nanocarbon-tube composite formula, intended to avoid short-circuit risk |
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| Net Weight | 2.0 g |
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| Model Identifiers | coxbyte TG-30 |
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