Coxbyte TG-30 is a 20 g thermal paste rated at 17.5 W/mK, designed for heat transfer on CPUs and GPUs; it suits PC builders and upgraders cooling gaming systems, graphics cards, or workstations.
Recommended For
- PC builders repasting a desktop CPU or graphics card who want a conventional thermal paste for chip-to-cooler contact; Coxbyte positions TG-30 for CPU/GPU cooling and PC upgrades.
- Repair shops or PC maintainers servicing several systems who can use the 20 g quantity across multiple CPU/GPU repastes; Coxbyte also lists multi-system maintenance as an intended use.
- Owners or technicians repasting gaming PCs and workstations that run sustained or heavy workloads; Coxbyte markets TG-30 for these systems and describes its formula as intended to handle repeated heating and cooling cycles.
- Laptop repairers replacing paste directly between a CPU/GPU chip and its cooler, especially when routine service includes cleaning and cooler removal; Coxbyte lists high-performance laptop maintenance as an application.
Spec Summary
| Attribute | Value |
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| Best For | Thermal management for CPU and GPU cores in gaming consoles, high-performance graphics cards, workstations, gaming laptops, AI inference cards, and small server cooling modules |
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| Thermal Performance | Thermal conductivity of 17.5 W/mK; operating temperature range of -50°C to 250°C after curing |
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| Composition And Electrical Properties | Nanocarbon tube composite formula with non-conductive properties |
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| Application And Compatibility | Optimized viscosity supports single-point or nine-point application into a uniform 0.15 mm thermal layer; compatible with copper, aluminum, and nickel-plated metal interfaces |
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| Service Life | Designed to resist dry cracking and carbonization during continuous high-temperature operation; performance degradation is stated to remain below 2% within six months |
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| Package Size | 20 g |
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| Model Identifiers | Coxbyte TG-30 |
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