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Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity
- Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
- Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
- Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity
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Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications. Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polymer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
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- Return for refund within: 30 days
- Return for replacement within: 30 days
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