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Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
- Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
- Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
- Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
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GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.
Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.
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Warranty
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by PlatinumMicro Return Policy
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