Your Browsing History
Ships from Hong Kong.
Most customers receive within 10-17 days.
Add to wish list(Found on 1 wish list)
Meet Your Seller
Thermalright Thermal Pad 12.8 W/mK, 85x45x2.5mm, Non-Conductive Heat Resistance High-Temperature Resistance, Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler (2.5mm)
- Product specifications: Thermal conductivity (W/mk): 12.8 W/mk; Color: Gray density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Specification size: 85×45 mm; Decomposition voltage: 9.8KV; Conductivity: None; Thickness of thermal pads: 2.5 mm.
- This thermal pad 2.5mm, you can freely cut the thermal pads according to your needs, perfectly fill the contact surface gap, is a good helper for beginners and professionals who use Odyssey thermal pad.
- Product function: EXCELLENT THERMAL CONDUCTIVITY - 85x45x2.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
- The thermal pad applied in electronic products, PC, CPU, GPU, PS4, Gelid, Heatsink, IC, LCD/PDP TV, LED lighting, automotive electronics, optoelectronics, graphics cards, DRAM memory modules, communication equipment, solid-state drives, automotive control equipment, Gaming equipment.
Overview
Specs
Reviews
Main Features
Thermal pad has 12.8 W/m K Thermal Conductivity, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect. At the same time, the thermal pad also has Insulation, Non-conductive, wear-resistant, fire-retardant, compression, buffering, no damage to metal materials, etc effect.
Why use thermal silicone Pad ?
The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface, And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact, Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.
Applicable industry: LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV, communications industry, Industrial industry, household electrical appliance industry.
Scope Application: electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine, power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation
Thermal pad has 12.8 W/m K Thermal Conductivity, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect. At the same time, the thermal pad also has Insulation, Non-conductive, wear-resistant, fire-retardant, compression, buffering, no damage to metal materials, etc effect.
Why use thermal silicone Pad ?
The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface, And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact, Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.
Applicable industry: LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV, communications industry, Industrial industry, household electrical appliance industry.
Scope Application: electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine, power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
- CONTACT
Return Policies
- Return for refund within: 30 days
- Return for replacement within: 90 days
- This item is covered by Corn Electronics Return Policy
Manufacturer Contact Info
- For a directory of all our manufacturers, please click below.
- Manufacturers Directory
LOADING...