• ¥3,152
  • Consumption Sales Tax-Inclusive Price
  • ¥159 Shipping
Ships from Hong Kong.
Most customers receive within 10-17 days.
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Meet Your Seller

Thermalright TFX Thermal Compound Paste 14.3 W/mK, Carbon Based High Performance, Heatsink Paste, CPU for All Coolers, Interface Material, 2 Grams with Tool

  • High thermal conductivity
  • Safe application
  • High durability
  • Easy to apply
  • Thermal compound
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Overview
Specs
Reviews (7)
Easy to Apply With an ideal consistency, the TFX is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler.
Excellent Performance TFX Thermal Conductivity: 14.3 W/mK (MX-4 is only 8.5 W/mk). The heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking. Safe Application It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compound, it ensures that contact with any electrical pins would not result in damage of any sort. TFX 2 Grams With tool
Thermal Conductivity: 14.3 W/mK

Warranty & Returns

Warranty, Returns, And Additional Information

Return Policies*

  • Return for refund within: 30 days
  • Return for replacement within: non-replaceable
  • This item is covered by Corn Electronics Return Policy
  • *Subject to applicable law
  • Warranty Notice:

    This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.

Manufacturer Contact Info

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