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G.SKILL Ares Series 8GB (2 x 4GB) DDR3 2133 (PC3 17000) Desktop Memory Model F3-2133C9D-8GAB
- DDR3 2133 (PC3 17000)
- Timing 9-11-10
- CAS Latency CL9
- Voltage 1.65V
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Overview
Specs
Reviews (19)
G.SKILL ARES is built for ultra-high performance with rock solid stability. Rated at DDR3 2133 speed and at 9-11-10-28 timings, the ARES memory kit F3-2133C9D-8GAB serves and powers your system in your daily battles of gaming and computing. Extensive tests ensure peace of mind reliability. The low-profile heat spreader allows installation in systems even with a small form factor. Intel XMP support makes overclocking a breeze.
Ultra High Performance and Solid ReliabilityRated at 2133MHz at 9-11-10-28, the super-sized 8GB ARES memory kit F3-2133C9D-8GAB delivers up to 17.0GBps per channel to ensure outstanding performance. It is ideal for current operating systems and applications. Passing extensive reliability and compatibility tests with a wide range of Intel and AMD platforms, the ARES memory kit ensures solid reliability while maintaining overclocking headroom.
Low-Profile Heat Spreader DesignThese memory modules feature an advanced heat spreader for super heat transfer and dissipation. At only 3.2cm tall, the low-profile heat spreader is ideal for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts.
Intel XMP SupportThe G.SKILL Ares Series F3-2133C10D-8GAB memory kit comes with the latest Intel XMP standard for second- and third-generation Intel Core processors. It provides PC enthusiasts with an easy overclocking experience.
Ultra High Performance and Solid ReliabilityRated at 2133MHz at 9-11-10-28, the super-sized 8GB ARES memory kit F3-2133C9D-8GAB delivers up to 17.0GBps per channel to ensure outstanding performance. It is ideal for current operating systems and applications. Passing extensive reliability and compatibility tests with a wide range of Intel and AMD platforms, the ARES memory kit ensures solid reliability while maintaining overclocking headroom.
Low-Profile Heat Spreader DesignThese memory modules feature an advanced heat spreader for super heat transfer and dissipation. At only 3.2cm tall, the low-profile heat spreader is ideal for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts.
Intel XMP SupportThe G.SKILL Ares Series F3-2133C10D-8GAB memory kit comes with the latest Intel XMP standard for second- and third-generation Intel Core processors. It provides PC enthusiasts with an easy overclocking experience.Warranty & Returns
Warranty, Returns, And Additional Information
Return Policies*
- Return for refund within: 30 days
- Return for replacement within: non-replaceable
- This item is covered by Hot Deals 4 Less Return Policy
- *Subject to applicable law
Warranty Notice:
This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.
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