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Iceberg Thermal IceFLOE T65 ITX Low Profile 3 Heat Pipe Extrusion Aluminum Heatsink HTPC CPU Cooler with 80mm Fan

  • Tuned 3 Heat Pipe Extrusion Heatsink, Performs Up To 65W TDP
  • 4-Pin, 80mm PWM Fan, 1000 - 3000 RPM, (<) 31.5 dBA
  • Hydraulic Bearing
  • Infinite RAM Clearance, Copper Base, and Nickel Plating for Ultimate Performance with Pre-Applied FUZEIce
  • Socket Compatibility: Intel® LGA 1200, 115X, 1366, 775, AMD AM5, AM4, AM3(+), AM2(+), FM2(+)
Choking Hazard Small parts. Not for children under 3 years.
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Products
Maximum TDP 65 W 95 W 160 W 170 W 180 W
LGA 1700 Compatible - - Yes Yes Yes
AM5 Compatible Yes Yes Yes Yes Yes
RAM Clearance Infinite Infinite Adjustable, 35 - 56 mm Adjustable, 35 - 56 mm Adjustable, 35 - 56 mm
Noise Level 31.5 dBA 32.3 dBA 20.5 dBA 20.5 dBA 22.5 dBA
Fan Speed 1000 - 3000 RPM 1000 - 2200 RPM 600 - 1200 RPM 600 - 1200 RPM 600 - 1400 RPM
Heatpipes Ø 6 mm x 3 - Direct Touch Ø 6 mm x 3 Direct Touch Ø 6 mm x 4 Direct Touch Ø 6 mm x 4
Bearing Hydraulic Bearing Hydraulic Bearing Fluid Dynamic Bearing Fluid Dynamic Bearing Fluid Dynamic Bearing
IceFLOE T65 Technical Specifications
Maximum TDP 65 W
RAM Clearance Infinite
Heatpipe Ø 6 mm x 3
Heatsink Aluminum Extrusion, Copper Base
Surface Finishing Nickel-plated
Thermal Compound Pre-applied FUZEIce
Dimensions 100 (L) x 88 (W) x 38 (H) mm
Weight 309 g
Compatible Socket Intel LGA 1200, 115X, 1366, 775 / AMD AM5, AM4, AM3(+), AM2(+), FM2(+), FM1
Fan Size / Speed 80 mm, 1000 - 3000 RPM
Voltage / Current 12 V / 0.22 A
Airflow 37.6 CFM
Static Pressure 3.02 mm H2O
Bearing Hydraulic Bearing
Connector 4-pin PWM
MTTF > 40000 hours
Iceberg Thermal IceFLOE T65 Low Profile CPU Cooler boasts three 6mm heat pipes. It is compatible with both Intel & AMD. IceFLOE T65 is ideal for HTPC and Small Form Factor. With its Copper Base, 80mm PWM Fan, and Small but Powerful Compact Design, this sleek little Cooler gets the job done with up to TDP 65W. Infinite RAM clearance gives you unlimited space for your RAM module. Tuned copper heat pipes are engineered based on the latest requirements, transmitting heat away from the chipset.

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