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JunPus Nano Diamond Thermal Grease JP-DX1 ,Overclocking Thermal Compound , Best Thermal paste (3g)
- JP-DX1
- JP-DX1
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Overview
Specs
Reviews (3)
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Specifications
JunPus JP-DX1 Nano Diamond Thermal Grease (3G)
Thermal Conductivity 16 w/m-K
Thermal Impedance 0.05 cm²/W
Specific Gravity 2.7 g/cm³
Recommended storage time (Before use) up to 3 years
Recommended usage time (On the CPU) up to 4 years
Peak operating temperature -50°C to +250°C
Recommended operating temperature -40°C to +240°C
Weight 3g
Overview
JP-Diamond-Series is a top-quality heat sink compound
product developed most recently by Taiwan & Russian
nano technology. Made with high purity thermal conducting
materials, JP-Diamond-Series exhibits excellent thermal
conduction thanks to its finer molecular structure produced
by nanoscale treatment. JP-Diamond-Series has the
following superior properties such as high chemical stability,
being non-corrosive, Antioxidation, non-toxicity, non-volatility,
non-flammability, and causing no irritation to human skin.
It can withstand long-term storage, does not easily solidify,
and can Bereadily implemented to the printing and coating
process.
Key Features
Thermal Conductivity
Low Thermal Resistance
Non-Curing
Non-Corrosive
Easy Application with Included Razor Blade
Color: Gray
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
- CONTACT
Return Policies
- Return for refund within: 30 days
- Return for replacement within: 60 days
- This item is covered by JunPus Return Policy
Manufacturer Contact Info
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