

This is a thermal paste with excellent performance and easy application.
It is a non-conductive adhesive used between CPU/GPU and designated coolers to transfer component heat dissipation to the heat sink.
Eliminating the risk of short circuits and, in turn, providing more protection for your computer.
The new formula has excellent thermal conductivity and low heat cation.
These characteristics effectively dissipate the heat dissipation of the core components. Its texture is only delicate enough to be spread with fingers in the components without causing too much confusion.