Specially designed for overclocking
- Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.
- In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.
- The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.
Feature
- Nano particle structure
- Fine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity.
- Stability
- A special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.
- Non-conductive
- There is no concern about shorts due to non-conductivity.
Easy to Apply
Mainly used in computer CPU GPU PS4 LED... Thermal.With an ideal consistency, the HY883 thermal paste is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video.
Specially designed for overclocking
- Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.
- In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.
- The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.
Feature
- Nano particle structure
- Fine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity.
- Stability
- A special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.
- Non-conductive
- There is no concern about shorts due to non-conductivity.
Easy to Apply
Mainly used in computer CPU GPU PS4 LED... Thermal.With an ideal consistency, the HY883 thermal paste is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video.