TFX 2g Extreme Performance Thermal Compound Paste 2 Grams, 14.3W/mK, High Durability, for All Heatsinks CPU Coolers, Safe Application,with applying Tool

High performanceExcellent performance comes from its first-class data, thermal conductivity up to 14.3W/m.k, it has a good record of high cooling performance, Its high thermal conductivity ensures the speed and efficiency of heat conduction, which is the choice of overclocking game player.
StabilityThe available temperature is -250 / +300, thermal resistance < 0.0028, Density is 2.6 (25). Even in high or low temperature environment, its cooling advantage will not be affected
DurabilityThermal conductive silicone grease has long service life and low volatility, which can maintain its thermal conductivity in CPU, GPU, radiator module, chipset, sensor and other electronic components for a long time
Application Method Although this heat dissipation paste is a bit dry, its heat dissipation effect is the best and more durable than other heat dissipation pastes. You can squeeze out five small dots on the CPU and press them down with a heat sink. If you have any questions, you can consult the store customer service
Easy to applyThe needle-type designs is convenient for application and storage. With a spatula, it is easy to apply

	AX120R SE	AXP90 X67 BLACK	PA120	SS135 WHITE	84450.5(14.8w/mk)	BCF BLACK

Customer Reviews	—	—	—	—	—	—
Price	—	— no data	—	— no data	— no data	—
Heatpipe	4×6mm heatpipes	6×6mm heatpipes	6×6mm heatpipes	6×6mm heatpipes	no data	no data
CPU Sockel	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA1700; AMD: AM4:AM5	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4:AM5	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4	no data	Intel: LGA1700
Lüfter Geschwindigkeit	1550±10%RPM	1800±10%RPM	1500±10%RPM	1850±10%RPM	no data	no data
Höhe	148MM/5.83in	67MM/2.64in	157MM/6.18in	135MM/5.31in	no data	no data
Rolle	CPU-Kühler	CPU-Kühler	CPU-Kühler	CPU-Kühler	Thermische Pads	Intel-CPU der 12. Generation mit Anti-Bender

	AX120R SE	AXP90 X67 BLACK	PA120	SS135 WHITE	84450.5(14.8w/mk)	BCF BLACK

Customer Reviews	—	—	—	—	—	—
Price	—	— no data	—	— no data	— no data	—
Heatpipe	4×6mm heatpipes	6×6mm heatpipes	6×6mm heatpipes	6×6mm heatpipes	no data	no data
CPU Sockel	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA1700; AMD: AM4:AM5	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4:AM5	Intel: LGA1150, LGA1151, LGA1155, LGA1156,LGA1200, LGA2011, LGA2066, LGA1700; AMD: AM4	no data	Intel: LGA1700
Lüfter Geschwindigkeit	1550±10%RPM	1800±10%RPM	1500±10%RPM	1850±10%RPM	no data	no data
Höhe	148MM/5.83in	67MM/2.64in	157MM/6.18in	135MM/5.31in	no data	no data
Rolle	CPU-Kühler	CPU-Kühler	CPU-Kühler	CPU-Kühler	Thermische Pads	Intel-CPU der 12. Generation mit Anti-Bender

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