Thermalright Odyssey Thermal Pad 12.8 W/mK, 120x120x1mm, Heat Resistance, High-Temperature Resistance, Non-Conductive, Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED/Gelid/PS4(120 * 120 * 1mm)

Product specifications: Thermal
conductivity (W/mk): 12.8 W/mk;
Color: Gray
density (G/cc): 3.1 ± 0.2;
Hardness (Sc): 30~55;
Specification size: 120×120 mm;
Decomposition voltage: 9.8KV;
Conductivity: None;
Thickness of thermal pads: 1 mm This thermal pad 1mm, you can freely cut the thermal pads according to your needs, perfectly fill the contact surface gap, is a good helper for beginners and professionals who use Odyssey thermal pad.
Product function: EXCELLENT THERMAL CONDUCTIVITY - 120x120x1mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds. The thermal pad applied in electronic products, PC, CPU, GPU, PS4, Gelid, Heatsink, IC, LCD/PDP TV, LED lighting, automotive electronics, optoelectronics, graphics cards, DRAM memory modules, communication equipment, solid-state drives, automotive control equipment, Gaming equipment, laptops, and other industries, which Perfectly replaces traditional thermal paste heatsink compound grease. The thermal pads applied high-performance thermal conductive materials to eliminate air gaps, thereby improving the overall thermal conversion capability and enabling the device to work at a lower temperature, We are committed to providing high-quality thermal pads, easy to install, easy to Cutting.