BGA Stencil Reballing Holder Station Kit,Aluminum Alloy Universal BGA Reballing Station Solder Rework Kit with Handles+Stencils+Balls Kit

Can correspond to BGA of different sizes, maximum chip size is 50*50mm.
BGA chip secedes steel stencils size is 90*90mm.

BGA Stencil Reballing Holder Station Kit, Aluminum Alloy Universal BGA Reballing Station Solder Rework Kit with Handles+Stencils+Balls Kit
Can correspond to BGA of different sizes, maximum chip size is 50*50mm.
The upper cover has a which is convenient for removal of excess tin balls.
Aluminum alloy structure, the structure is light and.
Features:
Aluminum alloy structure, the structure is light and.
The upper cover has a which is convenient for removal of excess tin balls.
One reballing station can be used with different stencils.
Can correspond to BGA of different sizes, maximum chip size is 50*50mm.
BGA chip secedes steel stencils size is 90*90mm.

Specifications

:
Material: Aluminum alloy
Tin Balls Size: 0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm
Weight: 635g(approx. )
Package Includes:
1 x BGA Reballing Station with Handles (90*90mm)
9 x Steel Stencils
4 Bottles x Tin Balls ( 0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm)
1 x Desoldering Wick
1 x Brush
1 x Tap
1 x Tn Shaving Pen
1 x Hex Key