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1. Avoidance design, super compatibility, does not block any melting resistors, more suitable for ITX small chassis, small size+high performance
2. Discounted FIN thickened heat dissipation fins further enhance heat dissipation, using nano spraying technology for a more advanced texture and a lifespan of over 10 years
3. Optimize the internal capillary structure and coolant of the heat pipe to achieve powerful heat dissipation performance of the radiator, whether in a vertical or horizontal chassis
4. Seamless welding of copper pipes, mirror polishing, combined with 50 heat dissipation fins to fully contact the CPU, efficient heat conduction, reaching the freezing point.
5. Multi platform compatible design with strong applicability