High-Density PCB Board: Utilizes multi-layer PCB design with high impedance control accuracy, reducing signal transmission loss. The motherboard has a low deformation rate, ensuring long-term operational stability.
Power Management System: Digital power design supporting dynamic voltage regulation for CPU/GPU. High precision in power consumption control guarantees stable performance of high-performance hardware.
Covered Heat Dissipation Armor: Copper foil and carbon coating for heat conduction, minimizing temperature differences in key chips and effectively extending component lifespan.
Modular Interface Design: Key motherboard interfaces use modular packaging, making it easy to replace damaged interfaces.
Laptop A1932 A2179 Motherboard For 13" A2337 M1 Logic Board 820-01521-A 820-01958-A 820-02016-A 2018 2019 2020