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Thermal Paste CPU 3.5g with Toolkit for CPU GPU IC and Heatsinks
- SAFE APPLICATION: Metal-free and non-conductive design eliminates the risk of short circuits while adding extra protection for CPU and VGA cards.
- BETTER THAN LIQUID METAL: Made with carbon microparticles, this thermal paste provides excellent thermal conductivity, helping transfer heat away from CPU/GPU quickly and efficiently.
- HIGH DURABILITY: The advanced formula delivers excellent heat dissipation performance and stable thermal management, helping maintain reliable system performance during demanding workloads.
- EXCELLENT PERFORMANCE: Unlike metal and silicon-based thermal conductive adhesives, BSFF thermal paste maintains consistent performance over time. Once applied correctly, it provides reliable thermal transfer for long-term use.
- EASY TO APPLY: Designed with an ideal consistency, the thermal paste spreads smoothly and evenly. The included toolkit helps with precise application, making it simple for both beginners and experienced users.
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Product information
| Product Dimensions | 4.33 x 4.33 x 1.57 inches |
| Item Weight | 0.141 ounces |
| Manufacturer | Nuomi |
| Item model number | BS-139 |
| Date First Available | December 14, 2021 |
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Cathatnik Return Policy
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