ASUS PRIME B860M-A WIFI-CSM Motherboard & Intel Ultra 9 285K CPU Combo,B860 LGA 1851 mATX motherboard,Intel® Core Ultra Series 2 Ready,Advanced AI PC-ready,+1+1+1 stage,DDR5,PCIe 5.0 x16,HDM,WiFi 6E

Motherboard & CPU & Thermal grease Combo

Motherboard: PRIME B860M-A WIFI

ASUS Corporate Stable Model (CSM) is a commercial program designed to provide stable and reliable motherboards.

Ready for Advanced AI PC: Designed for the future of AI computing, with the power and connectivity needed for demanding AI applications

Intel® LGA 1851 Socket: Ready for Intel® Core Ultra Processors (Series 2)

Robust Power Solution: 7+1+1+1 80A DrMOS power stages, 8 pin ProCool power connector, alloy chokes and durable capacitors for stable power delivery

Latest M.2 Support: One onboard PCIe 5.0 M.2 slot equipped with one M.2 heatsink and one PCIe 4.0 M.2 slot

Ultrafast Connectivity: WiFi 6E, PCIe 5.0 x16 slot, Realtek 2.5Gb Ethernet, rear USB 20Gbps Type-C® port, front USB 10Gbps Type-C® connector

High-Performance Networking: On-board Wi-Fi 6E and Realtek 2.5 Gb Ethernet

Optimized Thermal Design: Enlarged VRM heatsinks, one M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+

DIY Friendly Design: Q-Dashboard, Q-DIMM, Q-LED Core, Q-slot

Intel Core Ultra 9 285K CPU

3nm (TSMC N3B) Arrow Lake 125W

36MB L3 Cache

40MB L2 Cache

Intel Graphics

Cooling device not included - Processor Only

Thermal grease: Shin-Etsu X-23-7868-2D

Coefficient of thermal conductivity:6.2 (W/m.k)

Thermal resistance :0.07 (°C*cm^2 7W)

Paste Color: Gray

Viscosity: 100 (Pa.s)

Replacement cycle: Suggested 2 years (Official lifespan 3-5 years)

Application difficulty: Easy to apply

Suggested Group: Suitable