ONEBOOM X400 2280 2TB M.2 NVMe PCIe 4.0 Gaming SSD, Speed Up to 7400MB/s, 3D NAND TLC, Internal Solid State Disk Compatible for PS5, M.2 2280 with Heatsink 2TB
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    Sold by Bktech
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    Arctic Silver 5 High Density Polysynthetic Silver Thermal Compound 3.5g

    • 5 High-Density
    • Polysynthetic Silver
    • Thermal Compound 3.5g
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    Specifications

    • Mfr Part Number: AS5- 3.5G
    • Features: Contains 99.9 % pure silver, High-Density(contains over 88% thermally conductive filler by weight), Controlled Tripple-Phase Viscosity, Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)


    Thermal Conductance: >300, 000W/m2 °C ( 0.001 inch layer)
    Thermal Resistance: <0.005°C-in2/Watt (0.001 inch layer)

    Average Particle Size: <0.49 microns <0.000020 inch

    Extended Temperature Limits:
    Peak: -50°C to >180°C Long-Term: 50°C to 130°C
    Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
    Coverage Area: The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.

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