Its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.
Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles.
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the syringe, Arctic Silver 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool.
The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.)
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices. Founded in 1999, the company's facilities are located in Visalia, California, US.