Thermal Pad Cooler Master's new Thermal Pad is an innovative solution to device cooling for a wide range of your electronic devices and components. Formulated with Nano Elements 13.3 w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat. Non-toxic and Non-corrosive Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening. Double-sided Adhesive Provides seamless and secure contact between surfaces. Wide Range of Application Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
Versatile and Easy Application Easily cut to the perfect size for your application. Multiple choices of thickness are available. Multiple Options of Thickness 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm are available to fit your application and they are sold separately.
NOTE: Please check the thickness with the product title before purchase! No Return & No Refund after Product is opened!
SPECIIFICATIONS: Dimensions 95 x 45 mm Thickness 0.5 mm Thermal Conductivity 13.3 (W/m. K) Color Purple Density (Specific Gravity) 3.4 ± 0.2 g/cc Hardness 30~60 Sc Breakdown Voltage 6KV/mm Working Temperature -40~200 C