Specifications
Mfr Part Number: AS5-12G
Features:
Contains 99.9% pure silver
High-Density(contains over 88% thermally conductive filler by weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)
Thermal Conductance: 300,000W/m2 °C (0.001 inch layer)
Thermal Resistance: 0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: 0.49 microns 0.000020 inch
Extended Temperature Limits: Peak: -50°C to 180°C Long-Term: -50°C to 130°C
Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core