Heatsink Thermal Conductive Adhesive For M.2 Next Generation Form Factor 2280 PCI-E NVME SSD

Description:

Features:

100% brand new and high quality.

The ultra thin radiator is designed for the notebook and some small space heat dissipation. 

Pure (401W/mk) has higher thermal conductivity than pure aluminum (237W/mk). 

Heat exchanger can exude heat faster by heat exchange through contact with air.

Support the M.2 NGFF SSD.

Support the NGFF SSD type 22x80.

Before purchase:

1. Please first use the ruler to measure the length and width of the chip of the M.2 solid state hard disk, and whether it matches the 67mmx18mm almost. 

2. The space above the hard disk also needs to be measured enough. The thickness of the heat sink is sold in 2mm, 3mm thickness, and if the heat sink is attached to other parts.

Specifications:

Material: Pure (401W/mk)

Color: Shown as pictures

Size: 67×18mm/2.64×0.71in (Approx.)

Thickness: 2#: 2mm; 3#: 3mm (Optional)

Quantity: 1 Set

Note: 

1.Transition: 1cm=10mm=0.39inch

2.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.

3.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package includes: (No retail package)

1 X Heatsink

1 X Thermal Conductive Adhesive