1Pcs CPU Thermal Conductive Adhesive Glue Heatsink Heat Sink Silicone Grease Paste Compound Glue for 3D Printer VGA Card

Please attention the information as below:

Brazil post office announced that from August 27, 2018, all international packages processed by customs will be charged  15 reais(about US$3.50) each package. This fee is paid by the buyer. If it is not paid within 30 days, the package will be returned.

CPU Thermal Conductive Heatsink Plaster Silicone Grease Adhesive Cooling Paste Compound Glue for 3D Printer

Features:

1. It has good conductivity and wide service temperature range(-60~200?), short term 300? high temperature.

2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.

3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.

4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.

Specifications:

Product weight: 5g

Quantity: 1pc, 5pcs

Heat conductive adhesive :white paste

Thermal conductivity >0.671W/m.k

Breaking strength 1.5MPA

Surface vulcanization time 10MIN /25?

Application: directly bonded solid components, LED and heat dissipation devices, etc.

Use for : Chip, CPU, Memory, North bridge, South bridge, VGA card, Other heat dissipation part

Operation Manual:

1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.

3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.

Note: