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product description:
Thermal paste (white paste);
Thermal conductivity>0.671W/m.k;
Breaking strength 1.5MPA;
Surface vulcanization time 10MIN/25°C
Scope of application:
High strength,
Fast bonding effect,
Suitable for all kinds of components, LEDs and heat sinks that need to be directly bonded firmly, etc.)
Packing specification:
5 g / stick,
The package is airtight and the jacket vacuum bag isolates the air and increases the storage time.
Product performance:
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C. In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free, and can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.
Instructions:
1. When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again;
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3, the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.