Original U6 PRO 100 g Thermal Putty for VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance, CSGR

U6 PRO, a premium-grade viscous thermal paste meticulously crafted for thermal pad replacement. Known as the "Liquid Thermal Pad" or "Thermal Putty", this cutting-edge formula is meticulously developed and produced by the esteemed Computer Systems research department in Thessaloniki, Greece.
U6 PRO is specifically engineered to excel in environments with high temperatures, making it the ideal choice for industrial electronics and high-end video boards. Each purchase includes a generous 20g packet of U6 PRO, providing ample quantity for approximately 20-40 applications.
For added convenience, the packet comes complete with a plastic spatula and 2x finger sleeves, ensuring easy and precise application.
Important Note:
Beware of counterfeit imitations. U6 PRO is an original product Made in Greece.
Applications:
Ideal for Automotive Electronic Control Units
Suitable for Heat sinks and Memory modules
Perfect for LED Lighting and LCD-TV applications
Excellent for Military Electronics
Reliable for Power Supplies
Trusted in Telecom services and Wireless instruments
Effective in Automotive control services

Product Features:
No expiration date, ensuring infinite storage and service life
U6 PRO doesnt dry out, maintaining consistent performance over time
Store in a closed can and protect from frost and dust to preserve quality
Made in Greece (European Union) for guaranteed authenticity and quality

Performance Data:
Computer Systems materials science laboratory testing: Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014). Combined thermal conductivity when 1.5 mm thick thermal pad is replaced with Upsiren U6 PRO combined with 1mm thick copper pad.

When to Replace Thermal Paste/Pads in Your Computer:

Thermal paste and thermal pads should be replaced every time the heat sink is removed (for cleaning, upgrades, or other maintenance) to ensure optimal thermal conductivity.
Replacing the thermal pads and gummy thermal paste used by many manufacturers on memory chips is crucial when the heat sink is removed. Reusing the same thermal pads or paste can lead to imperfect fits, resulting in overheating and potential component failure.
If your computer experiences overheating or shuts down after a few hours of use, immediate cleaning of the entire heat sink system and replacement of all thermal paste and thermal pads is recommended to prevent further issues.