UPSIREN UX PRO Ultra 50g jar High-viscosity nonconductive thermal putty for 24 mm gaps. Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*.

UPSIREN UX PRO Ultra 50g provides a workshop-friendly amount of our maximum conductivity non-electrically conductive thermal putty. It is built for wide-tolerance cooling assemblieswater cooling blocks, desktop GPUs and high-power consoleswhere millimeter-scale gaps defeat ordinary paste. It creates a cohesive heat path across uneven footprints around GDDR6/GDDR6X VRAM and VRM stages, stabilizing temperatures during sustained loads.

The 50 g jar balances capacity and handling for recurring service without moving to full bulk. Its straightforward to decant small portions for microscope work while keeping the main jar sealed to preserve texture and cleanliness over longer service cycles.

By holding a uniform 24 mm layer under clamp force, UX PRO Ultra turns the raw capacity of your loop or large heat sink into reliable component-level contact. The material is intentionally more viscous and only lightly tacky: form a ribbon or pad using the included sleeves, place it precisely, and press to create a clean, even footprint that resists pumpout over time. Produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research cofunded by Greece and the European Union.

Packet includes:

1 × 50 g jar of UPSIREN UX PRO Ultra thermal putty

1 × plastic spatula

2 × protective finger sleeves

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).